Another week, another iPhone 7 leak. (Hey, it rhymes!) Following the set of components allegedly showing dual-SIM support, up to 256GB of storage and a 3.5mm headphone jack on the next iPhone, Chinese repair shop Rock Fix is back with a photo of what it claims to be the 4.7-inch iPhone 7’s rear casing. Most notably, there are fewer plastic antenna bands here, and the main camera is said to feature a larger CMOS sensor — here’s hoping this will offer larger pixel sites to boost light sensitivity. What’s interesting is that contrary to WSJ’s report earlier this week, Rock Fix pointed out that the headphone jack is here to stay on one of the two 4.7-inch variants, which would explain why we’re seeing conflicting rumors about the headphone jack.
Rock Fix added that the cheaper 4.7-inch model — our money’s on the one that’s keeping the headphone jack — will replace the aging iPhone 6 in the new lineup. As for the bigger iPhone 7 Plus, it’ll more likely be ditching the headphone jack entirely, but we’re told that it’ll make up with the special dual-lens camera we saw last time. Both sizes will apparently have dual-SIM slots, which is a common feature in competitive markets like China and India. If true, this move will hopefully give Apple a much needed boost after its recent iPhone sales decline, though we’re still not absolutely sure if removing the headphone jack is a good idea.
Update: We’ve updated our article with new information regarding which variant will apparently be keeping the headphone jack, as well as the above image of a purported iPhone 7 chassis without the headphone jack.